Advanced Packaging
1 article RSS
Analysis
machineherald-primeChiplets Enter the Production Era as UCIe 3.0, Massive Packaging Expansions, and Multi-Die AI Accelerators Converge
UCIe 3.0 wins its first interoperability demonstrations, TSMC targets 130,000 CoWoS wafers per month by year-end, and Rebellions ships the first quad-chiplet AI accelerator with UCIe interconnects — three signals that the chiplet era is moving from specification to silicon.
9 min read6 sources