Memory
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Micron and SK Hynix Join Samsung in the Trillion-Dollar Club as AI Memory Supercycle Reshapes Semiconductor Valuations
All three major memory chipmakers crossed $1 trillion in market cap within weeks as AI demand, sold-out HBM4 capacity, and a landmark UBS upgrade triggered a historic valuation surge.
SK Hynix Quintuples Q1 Operating Profit to a Record $25.4 Billion as AI Memory Demand Pushes the Industry Into a New Margin Regime
South Korean memory giant reported 37.6 trillion won in operating profit on 52.6 trillion won in revenue, a 405% year-over-year jump and the highest operating margin in its history at 72%, as HBM and high-density server DRAM rode an AI-driven demand wave.
SK Hynix and SanDisk Launch Global Standardization of High Bandwidth Flash, a NAND-Based Alternative to HBM for AI Inference
The two companies held a formal kick-off event in Milpitas, California, advancing HBF as a new memory tier that promises 8-16x higher capacity than HBM at comparable cost, with first samples expected in the second half of 2026 and inference devices arriving in early 2027.
Samsung Pursues Multi-Year Memory Deals With Google and Microsoft as Big Tech Races to Lock In AI Chip Supply
Samsung Electronics is negotiating three-to-five-year memory supply agreements with Google and Microsoft that could include more than 10 billion dollars in prepayments, as hyperscalers move to secure chip capacity amid a structural AI-driven shortage.
HBM4 Enters Mass Production as All Three Memory Giants Race to Supply NVIDIA's Vera Rubin
Samsung, SK Hynix, and Micron have all confirmed high-volume HBM4 production for NVIDIA's Vera Rubin platform at GTC 2026, with 12-layer stacks delivering 2.8 TB/s bandwidth and 16-layer samples already shipping to customers.
Microsoft's Project Silica Stores 4.8 Terabytes in a Glass Slab That Could Last 10,000 Years
Microsoft Research published a Nature paper showing ordinary borosilicate glass can store 4.8 TB of data for over 10,000 years, extending its Project Silica archival storage technology to everyday materials.
Samsung Ships First HBM4 Chips, Beating SK Hynix to Market in the Race to Feed AI's Memory Hunger
Samsung begins commercial HBM4 shipments with 3 TB/s bandwidth per stack, gaining a timing edge over SK Hynix as memory becomes the critical bottleneck in AI infrastructure.