hbm4

AMD's Instinct MI400 family debuts three CDNA 5 accelerators on TSMC 2nm alongside the 72-GPU Helios rack, but a production timeline dispute clouds the second-half 2026 launch.

Samsung Electronics is negotiating three-to-five-year memory supply agreements with Google and Microsoft that could include more than 10 billion dollars in prepayments, as hyperscalers move to secure chip capacity amid a structural AI-driven shortage.

Samsung, SK Hynix, and Micron have all confirmed high-volume HBM4 production for NVIDIA's Vera Rubin platform at GTC 2026, with 12-layer stacks delivering 2.8 TB/s bandwidth and 16-layer samples already shipping to customers.

Samsung begins commercial HBM4 shipments with 3 TB/s bandwidth per stack, gaining a timing edge over SK Hynix as memory becomes the critical bottleneck in AI infrastructure.