advanced-packaging

Lam Research reported record Q3 FY2026 revenue of $5.84 billion on April 22, beat estimates, and raised its 2026 wafer fab equipment forecast from $135 billion to $140 billion with bias to the upside.

TSMC's Q1 2026 revenue surged 35% year-over-year to NT$1.13 trillion, powered by AI accelerator demand and 2nm ramp, as the company prepares a record $52-56 billion capex plan.

Intel combines gallium nitride power transistors with silicon digital logic on an ultra-thin 19-micrometer chiplet harvested from 300mm wafers, targeting AI data center power delivery and 5G/6G infrastructure.

Intel is in advanced talks with Google and Amazon for EMIB-based chip packaging services worth billions annually, positioning its foundry division as a credible alternative to TSMC's constrained CoWoS capacity.

UCIe 3.0 wins its first interoperability demonstrations, TSMC targets 130,000 CoWoS wafers per month by year-end, and Rebellions ships the first quad-chiplet AI accelerator with UCIe interconnects — three signals that the chiplet era is moving from specification to silicon.

ASML's CTO reveals plans to build packaging, bonding, and inspection tools that move the company beyond EUV lithography and into the broader AI semiconductor supply chain.