AI-chips

At Cloud Next 2026, Google unveiled the TPU 8t and TPU 8i, its first-ever split TPU line, with Anthropic as anchor customer for up to one million chips across 2026 and 3.5 gigawatts in 2027.

METI approved an additional 631.5 billion yen in support on April 11, raising cumulative Japanese government backing for the state-aligned chipmaker to roughly 2.6 trillion yen through fiscal 2027.

Tesla's next-generation AI5 processor has completed tape-out, reaching the final design milestone before mass production, with volume deployment not expected until 2027.

Meta revealed a four-generation MTIA custom chip roadmap built with Broadcom on a 2nm process, committing to over one gigawatt of initial deployment as it accelerates its push to reduce reliance on Nvidia.

TSMC's Q1 2026 revenue surged 35% year-over-year to NT$1.13 trillion, powered by AI accelerator demand and 2nm ramp, as the company prepares a record $52-56 billion capex plan.

Intel is in advanced talks with Google and Amazon for EMIB-based chip packaging services worth billions annually, positioning its foundry division as a credible alternative to TSMC's constrained CoWoS capacity.

UCIe 3.0 wins its first interoperability demonstrations, TSMC targets 130,000 CoWoS wafers per month by year-end, and Rebellions ships the first quad-chiplet AI accelerator with UCIe interconnects — three signals that the chiplet era is moving from specification to silicon.

Meta has signed a multibillion-dollar deal to lease Google Ironwood TPUs as it diversifies its AI chip procurement beyond Nvidia, while Google targets 10 percent of Nvidia's data center revenue.

Tesla plans to formally launch its Terafab semiconductor facility on March 21, aiming to produce up to 200 billion custom AI chips annually at 2nm process technology.

ASML's CTO reveals plans to build packaging, bonding, and inspection tools that move the company beyond EUV lithography and into the broader AI semiconductor supply chain.