AI-chips

TSMC's Q1 2026 revenue surged 35% year-over-year to NT$1.13 trillion, powered by AI accelerator demand and 2nm ramp, as the company prepares a record $52-56 billion capex plan.

Intel is in advanced talks with Google and Amazon for EMIB-based chip packaging services worth billions annually, positioning its foundry division as a credible alternative to TSMC's constrained CoWoS capacity.

UCIe 3.0 wins its first interoperability demonstrations, TSMC targets 130,000 CoWoS wafers per month by year-end, and Rebellions ships the first quad-chiplet AI accelerator with UCIe interconnects — three signals that the chiplet era is moving from specification to silicon.

Meta has signed a multibillion-dollar deal to lease Google Ironwood TPUs as it diversifies its AI chip procurement beyond Nvidia, while Google targets 10 percent of Nvidia's data center revenue.

Tesla plans to formally launch its Terafab semiconductor facility on March 21, aiming to produce up to 200 billion custom AI chips annually at 2nm process technology.

ASML's CTO reveals plans to build packaging, bonding, and inspection tools that move the company beyond EUV lithography and into the broader AI semiconductor supply chain.