Hardware & Semiconductors
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Commerce Awards SandboxAQ $500 Million CHIPS Grant for AI Materials Discovery, Taking a Minority Equity Stake in Return
The U.S. Commerce Department will fund AI-driven work on PFAS-free chemicals, catalysts, rare earth-free magnets, and backup batteries, and take a minority equity stake in return.
SK hynix Ships 12-Layer HBM4E Samples Ahead of Schedule at 16 Gbps, Tightening the AI Memory Race With Samsung
SK hynix shipped 12-high HBM4E samples on June 18, months ahead of its own second-half timeline, three weeks after Samsung's May 29 shipment.
Tensordyne Sends Its Logarithmic-Math AI Chip Napier to TSMC, Claiming Four Times the Speed at a Fifth the Power of an Nvidia GB300 System
The startup says its 3nm Napier inference chip turns matrix multipliers into adders, with commercial sales of a 72-chip system slated for the second half of 2027.
Qualcomm Announces Snapdragon C, Pushing Windows on Arm and an On-Chip NPU Into $300 Budget Laptops
Qualcomm unveiled the Snapdragon C Platform for entry-tier Windows laptops starting at $300, with Acer, HP, and Lenovo as launch partners and devices expected later this year.
d-Matrix Moves Its Corsair Inference Accelerator Into Full Production, Betting On-Chip SRAM Beats the GPU at Decode
d-Matrix says its Corsair inference accelerator is in full production, pairing on-chip SRAM with GPUs to cut AI response times by more than 10x.
Illinois Team Stacks Three Layers of Silicon Transistors at 200°C, Reporting Near-Perfect Yields for Monolithic 3D Chips
A Nature study reports stacking three silicon transistor layers with 98-100% yields using bonding temperatures no higher than 200°C, offering a route to denser chips without smaller transistors.
TSMC Brings Its 'Super Power Rail' Backside Power to VLSI 2026, Claiming Up to 10% More Speed Over N2P as the Angstrom Era's Defining Feature Arrives
At the June 14-18 VLSI Symposium in Honolulu, TSMC details A16 with backside direct-contact power delivery, claiming 8-10% more speed or 15-20% less power versus N2P.
Snap Nears 2026 Consumer Launch of Standalone 'Specs' AR Glasses After Spinning Off a Subsidiary and Locking In a Multi-Year Qualcomm Snapdragon Deal
Snap is preparing a 2026 consumer launch of its standalone Specs AR glasses, having formed a dedicated subsidiary and signed a multi-year Qualcomm Snapdragon agreement.
SpacemiT Demos a 'Usably Quick' RISC-V Mini Desktop on Its 16-Core K3, as the Open Architecture Inches Toward Everyday Computing
At the Ubuntu Summit, SpacemiT showed its 16-core Key Stone K3 running Ubuntu responsively, with a Banana Pi board priced at roughly twice a Raspberry Pi 5.
Motorola Edge 70 Pro+ Launches in India at Rs 47,999 With a 50MP Periscope Telephoto and a 6,500mAh Silicon-Carbon Battery
Motorola's Edge 70 Pro+, a rebranded global Edge 70 Pro, arrives in India with a 3.5x periscope camera, a 5,200-nit display, and a silicon-carbon battery.
Intel Details Crescent Island Xe3P Inference GPU at Computex, Scaling to 480GB of LPDDR5X Without HBM
Intel's data-center inference GPU scales to 480GB of LPDDR5X in a 350W air-cooled PCIe card, sidestepping the HBM shortage that constrains Nvidia and AMD accelerators.
Intel's Diamond Rapids Xeon 7 Drops Hyperthreading for Up to 192 Performance Cores, Slated for 2027 on 18A-P
At Computex, Intel detailed its Diamond Rapids Xeon 7: up to 192 P-cores on 18A-P, 16 DDR5 channels and PCIe 6.0, but no Hyperthreading, arriving 2027.