semiconductors

HRL published a Nature paper on an 18-qubit silicon spin processor run by an onboard cryogenic chip, days after IBM agreed to acquire the lab.

Micron broke ground on July 4 on a ¥1.5 trillion ($9.3 billion) expansion of its Hiroshima fab to scale next-generation DRAM and HBM for AI, with Japan's METI pledging up to ¥500 billion in subsidies and equipment installation set to begin in the second half of 2028.

SK Hynix will list ADRs on the Nasdaq on July 10 to raise up to $29 billion, potentially the largest ADR offering on record, with all proceeds funding new chip fabs, advanced packaging, and EUV scanners.

Guangyuan is spending $1 billion on T-glass and low-dielectric glass cloth, pushing a Chinese supplier into a niche long dominated by Japan's Nittobo as AI-server demand tightens supply.

Washington startup Besxar is flying microwave-oven-sized 'Fabship' pods on Falcon 9 boosters, the first of 12 SpaceX flights testing whether the vacuum of space can produce purer semiconductor substrates.

SK hynix will spend 100 trillion won ($64.38 billion) on a new NAND fab and advanced packaging plant in Cheongju, part of a 392 trillion won Chungcheong buildout with Samsung.

Nokia will spend about $30 million to grow its Allentown, Pennsylvania test and packaging site up to tenfold, backed by state aid and a federal CHIPS tax credit.

South Korean startup XCENA raised a $135M Series B at a $570M valuation for its MX1 CXL memory device, betting AI's real bottleneck is memory, not compute.

At the 2026 VLSI Symposium, Intel said 18A-P, a drop-in upgrade to its 18A node, reached risk production with 9% higher performance at iso-power.

At the 2026 VLSI Symposium, imec and partners reported MoS2 and WS2/WSe2 transistors at a 50nm contacted poly pitch with 94% of devices operational, a step toward post-silicon logic.

The U.S. Commerce Department will fund AI-driven work on PFAS-free chemicals, catalysts, rare earth-free magnets, and backup batteries, and take a minority equity stake in return.

SK hynix shipped 12-high HBM4E samples on June 18, months ahead of its own second-half timeline, three weeks after Samsung's May 29 shipment.