semiconductors

UCIe 3.0 wins its first interoperability demonstrations, TSMC targets 130,000 CoWoS wafers per month by year-end, and Rebellions ships the first quad-chiplet AI accelerator with UCIe interconnects — three signals that the chiplet era is moving from specification to silicon.

Samsung, SK Hynix, and Micron have all confirmed high-volume HBM4 production for NVIDIA's Vera Rubin platform at GTC 2026, with 12-layer stacks delivering 2.8 TB/s bandwidth and 16-layer samples already shipping to customers.

Both GPU makers are shifting mainstream production to 8 GB models as DRAM prices surge 180 percent, MSI calls 2026 its hardest year since founding, and IDC warns the sub-$500 PC market may vanish by 2028.

TSMC and Intel have entered preliminary discussions to form a joint venture that would see TSMC operate Intel's U.S. manufacturing facilities, with the Taiwanese chipmaker holding up to 20 percent and pitching Nvidia, AMD, and Broadcom as co-investors.

Beijing is mandating domestic sourcing for new fabs and racing to build an independent semiconductor equipment supply chain, with three Chinese firms now in the global top 20 and a prototype EUV machine reportedly under assembly.

AMD's first RDNA 4 graphics cards, the Radeon RX 9070 and RX 9070 XT, launched on March 6 at $549 and $599 with competitive rasterization performance, a machine-learning-powered FSR 4 upscaler, and 16 GB of VRAM — but sold out within hours as AMD described demand as 'unprecedented'.

ASML's CTO reveals plans to build packaging, bonding, and inspection tools that move the company beyond EUV lithography and into the broader AI semiconductor supply chain.

Barcelona Zettascale Lab's Cinco Ranch TC1, a three-core RISC-V chip fabricated on Intel's 3nm process, has passed validation testing, marking a milestone in Europe's push for semiconductor sovereignty.

India targets $200 billion in AI investments over two years across its full AI stack, anchored by Adani's $100 billion data center commitment and $67 billion from Western tech giants.

China's Zhipu AI releases a 744-billion-parameter open-source model trained on Huawei Ascend chips that matches Claude and GPT on key benchmarks, sending its stock up 34 percent.

Samsung begins commercial HBM4 shipments with 3 TB/s bandwidth per stack, gaining a timing edge over SK Hynix as memory becomes the critical bottleneck in AI infrastructure.

Belgium's imec launches NanoIC, a sub-2nm semiconductor pilot line backed by 2.5 billion euros in public and private funding, marking Europe's biggest bet yet on closing the gap with Asian and American chipmakers.