Hardware & Semiconductors
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Infineon Opens €5 Billion Smart Power Fab in Dresden, the World's Largest for Power and Analog Chips, Three Months Ahead of Schedule
Infineon opened its €5 billion Smart Power Fab in Dresden on July 2, three months early, doubling its Dresden capacity and adding 1,000 jobs at what it calls the world's largest power-chip factory.
DriveNets Extends Its Disaggregated AI Fabric With Two Tomahawk 6 Platforms Delivering 102.4 Tb/s for Scale-Up, Scale-Out, and Scale-Across
DriveNets unveiled two Broadcom Tomahawk 6-based AI fabric platforms, the liquid-cooled 2600SL and air-cooled 2601S, each carrying 64 ports of 1.6 Tb/s for 102.4 Tb/s of capacity.
Etched Exits Stealth With Working Sohu Transformer ASIC, $800 Million Raised at a $5 Billion Valuation and Over $1 Billion in Chip Orders
Etched unveiled working A0 silicon for Sohu, its transformer-only inference ASIC, disclosing $800 million raised at a $5 billion valuation and more than $1 billion in signed customer contracts.
Microsoft Scales Hollow-Core Fiber for AI Data Centers With Corning and Heraeus After Setting a 0.091 dB/km Fiber-Loss Record
Microsoft is moving hollow-core fiber from pilot to production for Azure, partnering with Corning and Heraeus after a research team recorded the lowest optical-fiber loss ever measured, 0.091 dB/km.
AMD Ships FSR 4.1 Upscaling to Radeon RX 7000 GPUs Ahead of Schedule, Though Frame Generation Stays RDNA 4 Exclusive
AMD's Adrenalin 26.6.2 driver brings FSR 4.1 machine-learning upscaling to RDNA 3 Radeon RX 7000 cards using an INT8 model, but frame generation remains an RDNA 4 exclusive.
China's Chip-Material Makers Move on Japan's Turf as Guangyuan Commits $1 Billion to T-Glass for AI Servers
Guangyuan is spending $1 billion on T-glass and low-dielectric glass cloth, pushing a Chinese supplier into a niche long dominated by Japan's Nittobo as AI-server demand tightens supply.
Startup Besxar Flies Semiconductor 'Fabships' on Falcon 9 Boosters, Betting the Vacuum of Space Can Make Purer Chip Substrates
Washington startup Besxar is flying microwave-oven-sized 'Fabship' pods on Falcon 9 boosters, the first of 12 SpaceX flights testing whether the vacuum of space can produce purer semiconductor substrates.
Arista Unveils 7060XE7, a 1.6-Terabit Switch Family Built on Broadcom's Tomahawk 6, Targeting Rack-Scale AI Fabrics
Arista's new 7060XE7 series, powered by Broadcom's Tomahawk 6 silicon, brings 1.6T Ethernet to AI clusters, with Microsoft, Meta and Oracle backing the launch.
Kioxia and SanDisk Begin Sampling 332-Layer BiCS10 NAND, Claiming a 59 Percent Bit-Density Gain for AI Data-Center SSDs
The flash-memory partners started sampling their 10th-generation 3D NAND on July 3, targeting enterprise SSDs, with mass production reportedly slated for 2027.
SK hynix Commits 100 Trillion Won to Cheongju, Anchored by an 80 Trillion Won M17 NAND Fab, as Korea Doubles Down on AI Memory
SK hynix will spend 100 trillion won ($64.38 billion) on a new NAND fab and advanced packaging plant in Cheongju, part of a 392 trillion won Chungcheong buildout with Samsung.
Nvidia Becomes the Top Data Center Ethernet Switch Vendor by Revenue for the First Time, IDC Says, on $2.1 Billion of Spectrum-X Sales
IDC says Nvidia took the No. 1 revenue spot in data center Ethernet switching in Q1 2026 with $2.1 billion and a 21.5% share, edging Arista.
Nokia to Invest $30 Million Expanding Its Allentown Photonic-Chip Packaging Plant to Feed AI Data Centers
Nokia will spend about $30 million to grow its Allentown, Pennsylvania test and packaging site up to tenfold, backed by state aid and a federal CHIPS tax credit.