Hardware & Semiconductors
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HBM4 Enters Mass Production as All Three Memory Giants Race to Supply NVIDIA's Vera Rubin
Samsung, SK Hynix, and Micron have all confirmed high-volume HBM4 production for NVIDIA's Vera Rubin platform at GTC 2026, with 12-layer stacks delivering 2.8 TB/s bandwidth and 16-layer samples already shipping to customers.
NVIDIA IGX Thor Reaches General Availability as Industrial Edge AI Moves from Pilot to Production
NVIDIA launched IGX Thor at GTC 2026, bringing safety-certified edge AI to factories, hospitals, and rail networks as AT&T, Cisco, and a dozen hardware partners build commercial deployments.
AI's Insatiable Memory Appetite Forces NVIDIA and AMD to Retreat From 16 GB Gaming GPUs as PC Hardware Makers Warn of the Most Challenging Year Ever
Both GPU makers are shifting mainstream production to 8 GB models as DRAM prices surge 180 percent, MSI calls 2026 its hardest year since founding, and IDC warns the sub-$500 PC market may vanish by 2028.
AT&T Pledges $250 Billion Over Five Years to Rebuild U.S. Network Infrastructure for the AI Era
AT&T commits $250 billion through 2030 to expand fiber, 5G, and satellite networks, but analysts question how much is new spending versus relabeled costs.
TSMC and Intel Reach Preliminary Deal on Foundry Joint Venture as Chip Giants Navigate New Alliance
TSMC and Intel have entered preliminary discussions to form a joint venture that would see TSMC operate Intel's U.S. manufacturing facilities, with the Taiwanese chipmaker holding up to 20 percent and pitching Nvidia, AMD, and Broadcom as co-investors.
Xanadu Clears Final Shareholder Vote to Become the First Publicly Traded Photonic Quantum Computing Company
Crane Harbor shareholders approve SPAC merger with Xanadu Quantum Technologies, clearing the way for a $3.6 billion Nasdaq and TSX listing under ticker XNDU on March 27.
Sonos Launches $299 Play Speaker and $189 Era 100 SL as First New Hardware Under CEO Tom Conrad Signals Post-App-Crisis Recovery
Sonos unveils the $299 Play portable speaker with 24-hour battery and Bluetooth grouping, and the $189 Era 100 SL without microphones, marking CEO Tom Conrad's first hardware launch after the app-crisis era.
Tesla Targets March 21 for Terafab Launch, Its $25 Billion Bid to Build the World's Largest AI Chip Factory
Tesla plans to formally launch its Terafab semiconductor facility on March 21, aiming to produce up to 200 billion custom AI chips annually at 2nm process technology.
Apple Ships MacBook Pro With M5 Pro and M5 Max, Delivering 4x AI Performance and a New Wireless Chip
Apple's MacBook Pro refreshed with M5 Pro and M5 Max chips offers up to 128GB unified memory, Thunderbolt 5, Wi-Fi 7, and claimed 4x AI gains over the previous generation, shipping March 11.
China Sets 70 Percent Chip Equipment Target for 2027 as Sanctions Drive the Largest Forced Localization in Semiconductor History
Beijing is mandating domestic sourcing for new fabs and racing to build an independent semiconductor equipment supply chain, with three Chinese firms now in the global top 20 and a prototype EUV machine reportedly under assembly.
AMD Launches Radeon RX 9070 XT With RDNA 4 Architecture, Matching RTX 5070 Ti at $599 Before Supply Collapses
AMD's first RDNA 4 graphics cards, the Radeon RX 9070 and RX 9070 XT, launched on March 6 at $549 and $599 with competitive rasterization performance, a machine-learning-powered FSR 4 upscaler, and 16 GB of VRAM — but sold out within hours as AMD described demand as 'unprecedented'.
ASML Looks Beyond Its EUV Monopoly, Plans Advanced Packaging and Larger-Die Tools for the AI Chip Era
ASML's CTO reveals plans to build packaging, bonding, and inspection tools that move the company beyond EUV lithography and into the broader AI semiconductor supply chain.