tsmc

AMD's 6th Gen EPYC 'Venice' is ramping on TSMC 2nm — the first HPC chip on the node — with 256 Zen 6 cores and 1.6 TB/s memory bandwidth.

Apple and Intel have struck a preliminary agreement for Intel to manufacture some Apple chips, ending a six-year split and handing Intel Foundry its most consequential customer win yet.

TSMC debuted its A13 and A12 process nodes and updated its full roadmap through 2029 at its North America Technology Symposium, while confirming A16 volume production slides to 2027.

Tesla's next-generation AI5 processor has completed tape-out, reaching the final design milestone before mass production, with volume deployment not expected until 2027.

TSMC's Q1 2026 revenue surged 35% year-over-year to NT$1.13 trillion, powered by AI accelerator demand and 2nm ramp, as the company prepares a record $52-56 billion capex plan.

Intel is in advanced talks with Google and Amazon for EMIB-based chip packaging services worth billions annually, positioning its foundry division as a credible alternative to TSMC's constrained CoWoS capacity.

TSMC's Compact Universal Photonic Engine enters volume production in 2026, with NVIDIA's Spectrum-X Photonics switches and AMD's new $280 million R&D hub positioning optical interconnects as the successor to copper wiring in AI infrastructure.

The Semiconductor Industry Association reported February 2026 sales of $88.8 billion, a 61.8 percent year-over-year surge driven by AI infrastructure spending, as the chip market remains on pace to cross $1 trillion in annual revenue for the first time.

TSMC's US footprint could triple from $165 billion to $465 billion under a proposed tariff deal, with four Arizona fabs already fully booked before construction is complete.

Both x86 chipmakers have notified OEMs of 10-15% price increases effective March-April, as AI data center demand consumes manufacturing capacity and pushes delivery times from weeks to months.

Apple expands its U.S. supply chain initiative with four new semiconductor and sensor partners, committing $400 million as part of a broader $600 billion domestic investment push.

UCIe 3.0 wins its first interoperability demonstrations, TSMC targets 130,000 CoWoS wafers per month by year-end, and Rebellions ships the first quad-chiplet AI accelerator with UCIe interconnects — three signals that the chiplet era is moving from specification to silicon.